That in turn shrinks development times as well as the size and weight of audio system designs. This eliminates the need for extra components and the associated firmware. The device features an integrated buck controller, enabling simplified circuit design. Image used courtesy of STMicroelectronics The TDA7901 class G automotive amp has an integrated buck controller. Called the TDA790, the chip is a class G automotive power switching amplifier designed for efficient and high-definition audio applications. Qualcomm has announced two audio platforms for wireless listening and recording, while STMicroelectronics and ROHM Semiconductor have each unveiled devices that expand their audio portfolios.įor its part, STMicroelectronics has recently announced a new addition to their family of audio amplifier ICs.

In this article, we’ll zero in on three new developments in audio electronics from major semiconductor players. High-level example of audio system components. That said, engineers are always working towards developing the next generation of audio electronics with the goal of improving the experience of media consumption via future audio systems.

These technologies that enable these systems are capable of high fidelity sound capture and reproduction with as little data loss as possible with latency times in the tens of milliseconds. These innovations have enabled high-quality sound reproduction using devices smaller, more powerful music players-players with longer battery lives and a fraction of the cost of devices of the past. Streaming and broadcasting audio is a part of everyday life today thanks to the combined advancements in digital electronics and telecommunications.

Audio system designer